Method of joining metal member to resin member

Chemistry: electrical and wave energy – Processes and products

Patent

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Details

204 387, C25D 120

Patent

active

050008269

ABSTRACT:
A method of firmly joining a metal member developed by electroforming to a resin member. A metal member having a roughened, sponge-like surface is formed by electroforming on an electroform matrix. Then, a resin such as epoxy is applied thereto to develop a first resin layer having a smooth surface. Further, another resin layer is formed on the first resin layer. The resin member is interlocked with the roughened, sponge-like surface for firm joining of the resin member to the metal member.

REFERENCES:
patent: 4053370 (1977-10-01), Yamashita
IBM Technical Disclosure Bulletin vol. 14, No. 1, 6/71 p. 60.

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