Method of joining heat shrinkable closure members

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 86, 264230, 264342R, 174DIG8, B32B 3126

Patent

active

045869715

ABSTRACT:
A method of covering a substrate which comprises

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Nitto Electric Industrial Co., Ltd., product literature: "Nitto NEO Cover SW-01" and Nitto NEO Cover RW, undated.
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UBE Industries, Ltd., product literature: "UBE Joint Cover-G", undated, esp., pp. 2 and 31.

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