Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1974-10-04
1976-02-24
Smith, Al Lawrence
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228903, 228124, B23K 3102
Patent
active
039400506
ABSTRACT:
Disclosed herein is an improved method for joining diamond to metal using a gold-tantalum or gold-niobium solder. The method utilizes powdered material, and a clamp to keep the diamond in place during the soldering step. The article produces has higher mechanical stability than articles produced by known procedures.
REFERENCES:
patent: 2961750 (1960-11-01), Bender
patent: 3192620 (1965-07-01), Huizing et al.
patent: 3678568 (1972-07-01), Knippenburg et al.
Johnson Donald R.
Sawers, Jr. James R.
E. I. Du Pont de Nemours and Company
Joyce Margaret M.
Smith Al Lawrence
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