Method of joining diamond to metal

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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Details

228903, 228124, B23K 3102

Patent

active

039400506

ABSTRACT:
Disclosed herein is an improved method for joining diamond to metal using a gold-tantalum or gold-niobium solder. The method utilizes powdered material, and a clamp to keep the diamond in place during the soldering step. The article produces has higher mechanical stability than articles produced by known procedures.

REFERENCES:
patent: 2961750 (1960-11-01), Bender
patent: 3192620 (1965-07-01), Huizing et al.
patent: 3678568 (1972-07-01), Knippenburg et al.

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