Method of joining components

Details Method of joining components Method of joining components

2006-06-27

2006-06-27

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S455000, C438S459000

Reexamination Certificate

active

07067345

ABSTRACT:
A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.

REFERENCES:
patent: 5557120 (1996-09-01), Martin et al.
patent: 5959340 (1999-09-01), Wan et al.
patent: 6287940 (2001-09-01), Cole et al.

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