Method of joining beam leads with projections to device electrod

Details Method of joining beam leads with projections to device electrod Method of joining beam leads with projections to device electrod

1987-04-17

1988-11-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437209, 2281802, 357 69, H01L 2160, H01L 21603

Patent

active

047849720

ABSTRACT:
Disclosed is a method for making beam leads with projections and for joining such beam leads to electrodes of a semiconductor device. On a substrate (10), beam leads (12) with projections (12A) are concurrently formed using a single process. Semiconductor device (16) is pressed to beam lead (2) to join electrode (14) to projection (12A). When the semiconductor device is lifted, beam leads which are joined into the device are removed from the substrate. The concurrent formation of the beam leads (12) and projections (12A) can be carried out by plating using a substrate (10) having either a projection (10A) or a region (24A) of different resistance.

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