Method of joining a metal part having a copper surface and a gla

Details Method of joining a metal part having a copper surface and a gla Method of joining a metal part having a copper surface and a gla

1975-11-20

1977-09-20

Bashore, S. Leon

Glass manufacturing

Processes

Operating under inert or reducing conditions

65 59R, 106 53, C03G 2702

Patent

active

040494160

ABSTRACT:
Bonding a metal part having a copper surface to glass, in particular a semiconductor device. A small quantity of Cr.sub.2 O.sub.3 or CuO is added to the glass. The copper is oxidized at a relatively low temperature and relatively low oxygen pressure and thereafter sealing-in is performed in a nonoxidizing atmosphere.

REFERENCES:
patent: 2386820 (1945-10-01), Spencer
patent: 2803926 (1957-08-01), Ekkers
patent: 2955385 (1960-10-01), McDuffee
patent: 3069876 (1962-12-01), Certa et al.
patent: 3203084 (1965-08-01), Best
patent: 3607176 (1971-09-01), Milochevitch
patent: 3802892 (1974-04-01), Pirooz
patent: 3876407 (1975-04-01), Hirose et al.
patent: 3904426 (1975-09-01), Frieser et al.
patent: 3914517 (1975-10-01), Pirooz
patent: 3973975 (1976-08-01), Francel et al.
patent: 3982918 (1976-09-01), Frieser et al.

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