Method of joining a cover material to a substrate utilizing elec

Details Method of joining a cover material to a substrate utilizing elec Method of joining a cover material to a substrate utilizing elec

1997-10-28

1999-12-21

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562739, 1562757, 156321, 29718012, 219217, 219528, B32B 3120, B32B 3124

Patent

active

060044187

ABSTRACT:
The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed thereover and in heat transfer relationship to each other. The foam pad is placed thereover and the electrically conductive layer is energized to heat and activate the heat-activatable adhesive layer to allow bonding between the foam pad, the cover material and the electrically conductive layer.

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