Method of interconnecting wiring planes

Details Method of interconnecting wiring planes Method of interconnecting wiring planes

1985-09-30

1987-05-26

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, H05K 302

Patent

active

046674047

ABSTRACT:
A microelectronics apparatus and a method of fabricating customized connections between wiring planes superposed on a substrate is disclosed. A first wiring plane having multiple conductors is formed upon the substrate. An insulating layer is formed that overlies and electrically insulates the first wiring plane. A second wiring plane having multiple conductors is formed above the insulating layer by forming multiple conductors that are electrically connected to the first wiring plane with selected conductors of the first wiring plane being electrically connected to selected conductors of the second wiring plane. The connections may be modified by breaking selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.

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