Method of interconnecting conductors of different layers of a mu

Details Method of interconnecting conductors of different layers of a mu Method of interconnecting conductors of different layers of a mu

1985-12-02

1987-05-12

Larson, Lowell A.

Metal working

Method of mechanical manufacture

Electrical device making

29830, H05K 340

Patent

active

046638407

ABSTRACT:
The invention relates to a method of interconnecting conductors of different layers of a multilayer printed circuit board by forming a depression in the relevant conductor of the outermost layer, so that the insulation layer(s) is deformed and contact is made between the outermost layer and the appropriate conductor(s) of the next layer or layers.
The method can suitably be used in multilayer printed circuits on a substrate and in flexible multilayer printed circuits on an electrically insulating foil. In the latter case a temporary backing surface is required for the depression process. The substrate or the temporary backing surface must be deformable to a sufficient degree.

REFERENCES:
patent: 3037265 (1962-06-01), Kollmeier
patent: 3346950 (1967-10-01), Schick
patent: 4183137 (1980-01-01), Lomerson
patent: 4319708 (1982-03-01), Lomerson

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