Method of interconnecting a circuit board to a substrate

Details Method of interconnecting a circuit board to a substrate Method of interconnecting a circuit board to a substrate

2005-10-18

2005-10-18

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C029S846000

Reexamination Certificate

active

06954987

ABSTRACT:
A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

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