Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-09-19
2006-09-19
Smith, Matthew (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S059000
Reexamination Certificate
active
07109051
ABSTRACT:
A method for integrating an optical device and an electronic device on a semiconductor substrate comprises forming openings within an active semiconductor layer in a first region of the semiconductor substrate, wherein the first region corresponds to an electronic device portion and the second region corresponds to an optical device portion. A semiconductor layer is epitaxially grown overlying an exposed active semiconductor layer in the second region, the epitaxially grown semiconductor layer corresponding to an optical device region. At least a portion of an electronic device is formed on the active semiconductor layer within the electronic device portion of the semiconductor substrate. The method further includes forming openings within the epitaxially grown semiconductor layer of the optical device portion of the semiconductor substrate, wherein the openings define one or more features of an optical device.
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Cave Nigel G.
Zia Omar
Balconi-Lami Michael J.
Freescale Semiconductor Inc.
Goodwin David
Smith Matthew
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