Method of instrumenting a component

Stock material or miscellaneous articles – Composite – Of inorganic material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S332000, C428S702000, C427S446000, C427S455000, C427S556000

Reexamination Certificate

active

07572524

ABSTRACT:
A method of instrumenting a first component (210) for use in a combustion turbine engine (10) wherein the first component (210) has a surface contacted by a second component during operation of the combustion turbine engine (10). The method may include depositing an insulating layer (260) on the surface of the first component (210) and depositing a first conductive lead (232, 254) on the insulating layer (260). A piezoelectric material (230) may be deposited in electrical communication with the first conductive lead (232, 254) and a second conductive lead (236, 256) may be deposited in electrical communication with the piezoelectric material (230) and be insulated from the first conductive lead (232, 254) to form a sensor (50) for detecting pressure exerted on the surface of the first component (210) during operation of the combustion turbine engine (10).

REFERENCES:
patent: 3876998 (1975-04-01), Richter et al.
patent: 3890456 (1975-06-01), Dils
patent: 4382377 (1983-05-01), Kleinschmidt et al.
patent: 4546652 (1985-10-01), Virkar et al.
patent: 4578992 (1986-04-01), Galasko et al.
patent: 4595298 (1986-06-01), Frederick
patent: 4812050 (1989-03-01), Epstein et al.
patent: 4851300 (1989-07-01), Przybyszewski
patent: 4916715 (1990-04-01), Adiutori
patent: 4970670 (1990-11-01), Twerdochlib
patent: 4983034 (1991-01-01), Spillman, Jr.
patent: 5144299 (1992-09-01), Smith
patent: 5440300 (1995-08-01), Spillman, Jr.
patent: 5608282 (1997-03-01), Wilber et al.
patent: 5952836 (1999-09-01), Haake
patent: 5969260 (1999-10-01), Belk et al.
patent: 5970393 (1999-10-01), Khorrami et al.
patent: 6000977 (1999-12-01), Haake
patent: 6034296 (2000-03-01), Elvin et al.
patent: 6109783 (2000-08-01), Dobler et al.
patent: 6142665 (2000-11-01), Haffner et al.
patent: 6197424 (2001-03-01), Morrison et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6262550 (2001-07-01), Kliman et al.
patent: 6299410 (2001-10-01), Hilbert et al.
patent: 6331823 (2001-12-01), El-Ibiary
patent: 6343251 (2002-01-01), Herron et al.
patent: 6356340 (2002-03-01), Spence
patent: 6398503 (2002-06-01), Takahashi et al.
patent: 6422743 (2002-07-01), Nirmalan et al.
patent: 6437681 (2002-08-01), Wang et al.
patent: 6512379 (2003-01-01), Harrold et al.
patent: 6523383 (2003-02-01), Joki et al.
patent: 6532412 (2003-03-01), Adibhatla et al.
patent: 6556956 (2003-04-01), Hunt
patent: 6576861 (2003-06-01), Sampath et al.
patent: 6591182 (2003-07-01), Cece et al.
patent: 6604431 (2003-08-01), Soga et al.
patent: 6667725 (2003-12-01), Simons et al.
patent: 6735549 (2004-05-01), Ridolfo
patent: 6756908 (2004-06-01), Gass et al.
patent: 6760689 (2004-07-01), Follin et al.
patent: 6796187 (2004-09-01), Srinivasan et al.
patent: 6805949 (2004-10-01), Roche et al.
patent: 6816817 (2004-11-01), Retlich et al.
patent: 6831555 (2004-12-01), Miller et al.
patent: 6838157 (2005-01-01), Subramanian
patent: 6841116 (2005-01-01), Schmidt
patent: 6887528 (2005-05-01), Lau et al.
patent: 7270890 (2007-09-01), Sabol et al.
patent: 2004/0202886 (2004-10-01), Subramanian
patent: 2008/0054645 (2008-03-01), Kulkarni et al.
patent: 0 576 400 (1993-12-01), None
Jon Longtin, Sanjay Sampath, Richard J. Gambino, and Szymon Tankiewicz, Robert Greenlaw; Sensors for Harsh Environments by Direct Write Thermal Spray; Center for Thermal Spray Research, State University of New York, Stony Brook, NY, and Integrated Coatings Solutions, Inc., Huntington Beach, CA.
L. Lü, J. Y. H. Fuh, Y. S. Wong; Metal-Based System Via Laser Melting; Laser-Induced Materials and Processes for Rapid Prototyping; pp. 143-186; Chapter 6; The National University of Singapore; Kluwer Academic Publishers; Boston.
Sansay Sampath, Jon Longtin, Richard Gambino, Herbert Herman, Robert Greenlaw, and Ellen Tormey; Chapter 9: Direct-Write Thermal Spraying of Multilayer Electronics and Sensor Structures; Direct-Write Technologies for Rapid Prototyping Applications: Sensors, Electronics, and Integrated Power Sources; Copyright 2002; pp. 261-302; Academic Press, A Division of Harcourt, Inc.; San Diego.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of instrumenting a component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of instrumenting a component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of instrumenting a component will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4126603

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.