Method of installing circuit member in resin-molded panel

Details Method of installing circuit member in resin-molded panel Method of installing circuit member in resin-molded panel

2007-04-10

2007-04-10

Lee, Edmund H. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

C264S553000, C264S554000, C264S263000, C264S272110, C264S272150

Reexamination Certificate

active

10418126

ABSTRACT:
A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.

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patent: 6578263 (2003-06-01), Ichikawa et al.
patent: 09-019035 (1997-01-01), None

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