Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Patent
1998-12-04
2000-04-04
Picardat, Kevin M.
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
438 14, 438 15, G01R 3126, H01L 2166
Patent
active
06046061&
ABSTRACT:
A method of water mark inspection. By forming a pattern on a test wafer, the water mark formed thereon directly reflects the features of a wafer product to be evaluated. The water mark is formed by simulating fabrication process conditions of forming the wafer product of which the performance is to be evaluated. Thus, after scanning the water mark by a defect inspection machine, the performance of the wafer product is evaluated.
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patent: 5503708 (1996-04-01), Koizumi et al.
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patent: 5803980 (1998-09-01), Pas et al.
patent: 5932493 (1999-08-01), Akatsu et al.
patent: 5943549 (1999-08-01), Motoura et al.
Chen Eddie
Huang Cheng-Chieh
Liu Tse-Wei
Tsao Li-Wu
Yu Tang
Collins D. Mark
Huang Jiawei
Picardat Kevin M.
United Silicon Incorporated
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