Method of inspecting solder joints

Details Method of inspecting solder joints Method of inspecting solder joints

1991-06-03

1992-04-28

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 565, 29593, 118713, B23K 100

Patent

active

051080249

ABSTRACT:
A solder joint inspection system comprises a substrate (60) having at least one solder pad (56), a predetermined amount of solder (54) on the solder pad, and an image fluxing material (52) that fluoresces when an ultraviolet light source (42) is applied to the solder (54) and the fluxing material (52). When an ultraviolet light source is applied to the substrate having a predetermined amount of solder and fluxing material, a visual inspecting device (40) can verify if, in fact, the predetermined amount of solder and fluxing material is present.

REFERENCES:
patent: 4944447 (1990-07-01), Thome
IBM Technical Disclosure Bulletin, "Micromanipulator Liquid Contact Tester Probe", vol. 15, No. 1, p. 344, Jun. 1972.
IBM Technical Disclosure, Inspection Technique for Solder Reflow Pad Height/Volume, by T. Ross and A. Townsend, vol. 22, No. 9 Feb. 1980.

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