Method of inspecting semiconductor device chip patterns on a...

Details Method of inspecting semiconductor device chip patterns on a... Method of inspecting semiconductor device chip patterns on a...

2011-01-25

2011-01-25

Nguyen, Ha Tran T (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754010, C324S756030, C324S762050, C438S015000, C438S018000

Reexamination Certificate

active

07876119

ABSTRACT:
An inspection method includes performing an inspection by applying a probe to pads of a contact check pattern located, together with a chip pattern, on a wafer, and performing an inspection by applying the probe to pads of the chip pattern if a result of the inspection using the contact check pattern is within a predetermined range. A pattern having the same size as that of the chip pattern, differing in external appearance from the chip pattern, and having the same pads as those of the chip pattern is used as the contact check pattern.

REFERENCES:
patent: 5014003 (1991-05-01), Ishikawa
patent: 5239191 (1993-08-01), Sakumoto et al.
patent: 02-105436 (1990-04-01), None
patent: 07-037941 (1995-02-01), None
patent: 2004-079764 (2004-03-01), None

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