Method of inspecting particles on wafers

Details Method of inspecting particles on wafers Method of inspecting particles on wafers

1996-08-08

1997-06-17

Font, Frank G.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

356338, G01N 2100

Patent

active

056402384

ABSTRACT:
A method of inspecting particles on wafers is disclosed, wherein a first particle map is made by particle measurement on a wafer to be inspected, then a particle removing treatment is conducted to remove particles from the wafer, subsequently after a second particle map is made by particle measurement on the wafer which is subjected to the particle removing treatment, the first particle map is compared with the second particle map, and particles appearing at the immobile point common in both the first particle map and the second particle map are determined as crystal defects or surface irregularities such as scratches and particles appearing in the first particle map but those disappearing in the second particle map are determined as real dust particles or contaminants, thereby accurately detecting particles on wafers.

REFERENCES:
patent: 5293538 (1994-03-01), Iwata et al.
patent: 5355212 (1994-10-01), Wells et al.

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