Method of inspecting jointed portion

Image analysis – Histogram processing – For setting a threshold

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

358101, 358106, G06K 944, H04N 700, H04N 718

Patent

active

051704447

ABSTRACT:
A bonded portion of a bonding wire jointed to a semiconductor chip, for example, is inspected by utilizing a image pickup device by a method which comprises the steps of image picking up a bonded portion plastically deformed, extracting the bonded portion as a mass of pixels each having predetermined brightness from an image picked up by the image pickup device, decreasing a size of the mass of the extracted pixels by carrying out, by at least one step, logical brightness conversion, i.e. filtering, operation on the basis of the relationship in brightness of one of the pixels with respect to other pixels which surround the one of the pixels, and repeating the brightness conversion operation till the mass of the extracted pixels is extinguished. A size of the bonded portion is detected in dependency on the number of times of the brightness conversion operations carried out till the mass of the pixels is extinguished to thereby evaluate the quality of the bonded portion. A center of the mass of the pixels is simultaneously detected as a center of the bonded portion just before a time when the mass thereof is exinguished to thereby inspect a position of the bonded portion.

REFERENCES:
patent: 3846754 (1974-11-01), Oka et al.
patent: 3889053 (1975-06-01), Lloyd et al.
patent: 4065212 (1977-12-01), Belleson
patent: 4809341 (1989-02-01), Matsui et al.
patent: 4949390 (1990-08-01), Overson et al.
patent: 5050229 (1991-09-01), Barski et al.
"A sequential algorithm for shrinking binary pictures"; Yokoi et al.; System Computer Controls; vol. 10, No. 4; 1979; pp. 69-75.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of inspecting jointed portion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of inspecting jointed portion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of inspecting jointed portion will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-965772

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.