Method of inspecting electric characteristics of wafers and appa

Details Method of inspecting electric characteristics of wafers and appa Method of inspecting electric characteristics of wafers and appa

1989-10-12

1992-06-23

Lall, Parshotam S.

Boots, shoes, and leggings

364488, 2504911, 356401, 356394, G06F 1546

Patent

active

051249316

ABSTRACT:
In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.

REFERENCES:
patent: 3751647 (1973-08-01), Maeder et al.
patent: 3908118 (1975-09-01), Micka
patent: 3909602 (1975-09-01), Micka
patent: 4600996 (1986-07-01), Kawauchi
patent: 4780617 (1988-10-01), Umatate et al.
"An Automatic Optical Printed Circuit Inspection System" by R. C. Restnick, III, SPIE vol. 116 Solid State Imaging Devices, 1977, pp. 76-81.

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