Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-06-13
2006-06-13
Ahmed, Samir (Department: 2623)
Image analysis
Applications
Manufacturing or product inspection
C382S144000, C382S145000, C382S146000, C382S147000
Reexamination Certificate
active
07062080
ABSTRACT:
A circuit board with lead-free solder is inspected by using light sources with different colors at different angles to obtain an image having a plurality of color components. For each pixel within an area in the obtained image, the brightness of a white component generated by mixing all of the color components is extracted. The brightness of each of the color components of each pixel is reduced by an amount corresponding to the extracted brightness of the white component and is adjusted such that the brightest of the color components becomes more strongly emphasized compared to the others, than the brightness before the brightness-reducing process was carried out and the loss in total brightness caused by the brightness-reducing process is restored. The image with restored brightness is displayed and the surface condition of the solder is judged on the basis of the distributions of the color components of this image.
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Fujii Yoshiki
Fujita Yujin
Oshiumi Akira
Ahmed Samir
Beyer Weaver & Thomas LLP
Le Brian
Omron Corporation
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