Method of indirectly connecting two parts

Details Method of indirectly connecting two parts Method of indirectly connecting two parts

1978-07-27

1980-04-08

Esposito, Michael F.

Metal fusion bonding

Process

Using only pressure

228 31, 228 41, 228121, 228122, 427100, 427124, 427404, 427405, 427409, 4274196, B23K 120, B23K 2100

Patent

active

041968379

ABSTRACT:
A method of indirectly connecting two parts, such as an acousto-optical building component composed of lead glass and a piezo electric transducer composed of lead-zirconium titanate, whereby at least one mono-molecular layer (having a maximum thickness of 100 nm) composed of a lead-free glass is directly applied under vacuum onto the surfaces of the parts to be joined and metal layers are then applied under vacuuum onto such glass layer and/or the surfaces to be joined so that when the free surfaces of such free metal layers are brought into contact with one another under vacuum, a bond forms therebetween and such bonds indirectly connect the parts with one another. The glass layer prevents diffusion of atoms or ions from the materials (such as lead) on either side of such layer so that the parts so-joined and/or the bonds so-formed are not impaired in any way.

REFERENCES:
patent: 4037176 (1977-07-01), Ono
patent: 4077558 (1978-03-01), Allen
patent: 4129242 (1978-12-01), Dias

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