Method of increasing the area of a useful layer of material...

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Reexamination Certificate

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Reexamination Certificate

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07452584

ABSTRACT:
A composite structure in accordance with the invention includes front faces of first and second substrates that are molecularly bonded to each other, wherein the dimensions of the second substrate outline are larger than the first substrate outline. The front faces are molecularly bonded such that the outline of the first front face is disposed at least partially within the outline of the second front face. A peripheral ring extends around the first front face and facing the first substrate, in which bonding between the front faces is weak or absent, and has a maximum width of less than about 0.5 mm.

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M.K. Weldon et al., “Mechanism of Silicon Exfoliation by Hydrogen Implantation and He, Li and Si Co-implantation,” Proceedings 1997 IEEE International SOI Conference, Oct. 1997, pp. 124-125.

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