Method of improving the quality of soldered connections

Details Method of improving the quality of soldered connections Method of improving the quality of soldered connections

2005-06-07

2005-06-07

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S223000, C228S248100

Reexamination Certificate

active

06902100

ABSTRACT:
The invention relates to a method for improving the quality of soldered connections between large-area SMD components and wiring carriers, in the case of which the parts to be joined are electrically and mechanically connected to one another by reflow soldering, a flux being used to activate the solder. The intention of the invention is to provide a method of improving the quality of soldered connections which is simple to realize and particularly effective and with which the number of voids can be drastically reduced. According to the invention, this is achieved by the parts to be joined being positioned one over the other and connected to each other by forming a force of adhesion and by the parts to be joined being arranged in such a way that they are tilted at a predetermined tilting angle with respect to the normal plane, at least during the melting of the solder paste. The tilting angle during the melting should lie between greater than 0° and less than 180° and preferably be about 90°.

REFERENCES:
patent: 6418033 (2002-07-01), Rinne
patent: 6472068 (2002-10-01), Glass et al.
patent: 6708862 (2004-03-01), Fujii et al.
patent: 2003/0168495 (2003-09-01), Biedorf et al.
patent: 63005867 (1988-01-01), None
patent: 04075772 (1992-03-01), None
patent: 10215063 (1998-08-01), None
patent: 11135929 (1999-05-01), None
Translation of JP-10215063A.

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