Method of improving the adhesion of electroless metal deposits e

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427 97, 427 97, 427305, 427306, C23C 302

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active

042333440

ABSTRACT:
The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.

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patent: 3962494 (1976-06-01), Nuzzi
patent: 3962496 (1976-06-01), Leech
patent: 3982045 (1976-09-01), Kukanskis
patent: 3993799 (1976-11-01), Feldstein
patent: 4002778 (1977-01-01), Bellis et al.
patent: 4020197 (1977-04-01), Steffen
patent: 4042730 (1977-08-01), Cohen et al.
patent: 4096043 (1978-06-01), De Angelo

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