Method of improving the adhesion between a molded resin substrat

Coating processes – With pretreatment of the base

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106 1, 427 98, 427 99, 427250, 427304, 427305, 427306, 428418, 428457, C23C 302, C23C 1302

Patent

active

039782522

ABSTRACT:
An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.

REFERENCES:
patent: 3353986 (1967-11-01), Mathias
patent: 3445326 (1969-05-01), Hurst
patent: 3467540 (1969-09-01), Schick
patent: 3475186 (1969-10-01), Dutkewych
patent: 3619246 (1971-11-01), Bragole
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3783012 (1974-01-01), Morita et al.
patent: 3808028 (1974-04-01), Lando

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