Method of improving cleaving of diode arrays

Details Method of improving cleaving of diode arrays Method of improving cleaving of diode arrays

1989-11-21

1991-03-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437225, 437227, 437905, 156662, 156644, 156645, 148DIG168, 148 332, 225 2, H01L 21302, H01L 21304

Patent

active

049977938

ABSTRACT:
A relatively wide scribing channel is provided between the ends of each adjacent pair of diode array areas on a wafer to expose the epitaxial layer of the wafer. A scribing groove is then scribed in the scribing channel to define a cleavage line along which the array areas are separated.

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Suss RA 12a0 M Suss RA 120 Automatic Scribers, p. 3.

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