Method of improving adhesive property of polyimide film and poly

Coating processes – With pretreatment of the base – Organic base

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427223, 427354, 427368, 427371, 427307, 427379, 427384, B05D 300, B05D 308, B05D 312

Patent

active

058611924

ABSTRACT:
The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.
A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of;
execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.

REFERENCES:
patent: 3767538 (1973-10-01), Politycki et al.
patent: 3791848 (1974-02-01), DeAngelo
patent: 4078096 (1978-03-01), Redmond et al.
patent: 4152195 (1979-05-01), Bahrle et al.
patent: 4495253 (1985-01-01), Abel
patent: 4568632 (1986-02-01), Blum et al.
patent: 4711822 (1987-12-01), Choyke et al.
patent: 4755424 (1988-07-01), Takeoka et al.
patent: 4775449 (1988-10-01), Dumas et al.
patent: 4822451 (1989-04-01), Ouderkirk et al.
patent: 4824699 (1989-04-01), Woo et al.
patent: 4842946 (1989-06-01), Foust et al.
patent: 4847139 (1989-07-01), Wolf et al.
patent: 5104734 (1992-04-01), Anschel
patent: 5198264 (1993-03-01), Altman et al.
patent: 5527621 (1996-06-01), Matsuura et al.

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