Method of improving adhesion between insulating substrates and m

Details Method of improving adhesion between insulating substrates and m Method of improving adhesion between insulating substrates and m

1978-05-12

1980-08-05

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427 98, 427270, 427304, 427305, 427306, 427307, 427340, 427404, 156668, 430275, 430281, 430319, B05D 306

Patent

active

042162467

ABSTRACT:
A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble et al.
patent: 3466232 (1969-09-01), Francis et al.
patent: 3672937 (1972-06-01), Kallrath et al.
patent: 3672938 (1972-06-01), Zeblisky
patent: 3686359 (1972-08-01), Soldatas et al.
patent: 3698940 (1972-10-01), Merserego et al.
patent: 3730757 (1973-05-01), Knorre
patent: 3758304 (1973-09-01), Janssen et al.
patent: 3772078 (1973-11-01), Polichette et al.
patent: 3925138 (1975-12-01), Shaul et al.
patent: 4001466 (1977-01-01), Shaol et al.

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