Metal fusion bonding – Process – Plural joints
Patent
1995-09-01
1996-11-26
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
2282481, H05K 334
Patent
active
055776574
ABSTRACT:
Method of efficiently refiow soldering one or more devices to a printed circuit board with a convective heating oven, each device having a plurality of plate supported electronic connecting pins that are to be soldered within respective mating openings of the printed circuit board for electronic connection, the method comprising: (i) placing a solder paste in each of the openings; (ii) assembling the device to the circuit board by positioning the plate of the device along, but spaced in relation to, the printed circuit board to define a planar space therebetween, with the pins extending into such openings and into the soldered paste to thereby form an assembly; and (iii) passing the assembly through the convective heating oven for a time period to melt the solder paste and form a solid connection upon removal of the convective heat, said passing being carried out by use of convective heat focusing features that guide the convective heat flow between the plate and board to enhance convective heating of the solder paste from both sides of the board.
REFERENCES:
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4771929 (1988-09-01), Bahr et al.
patent: 4859520 (1989-08-01), Debuisson et al.
patent: 5263599 (1992-11-01), Moshina et al.
patent: 5309545 (1994-05-01), Spigarelli et al.
Ford Motor Company
Heinrich Samuel M.
Malleck Joseph W.
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