Method of implementing a capacitor in an integrated circuit

Details Method of implementing a capacitor in an integrated circuit Method of implementing a capacitor in an integrated circuit

2010-08-05

2011-12-27

Li, Meiya (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S499000, C257S528000, C257S532000, C257S685000, C257S704000, C257S724000, C257S778000, C257SE23079, C257SE23116, C257SE23124, C257SE23141, C257SE23153, C257SE23154, C438S107000, C438S108000, C438S109000, C438S110000

Reexamination Certificate

active

08084297

ABSTRACT:
A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.

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