Method of immobilizing a printed circuit board

Details Method of immobilizing a printed circuit board Method of immobilizing a printed circuit board

1976-05-13

1978-05-23

Arnold, Donald J.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264275, 264279, B29B 114, B29B 302

Patent

active

040910687

ABSTRACT:
A hardenable material such as epoxy is placed between a circuit board edge portion and a recessed channel of a keeper member mounted on a base. The epoxy fills the space between the channel walls and the board edge portion and immobilizes the board relative to the base once it hardens. This eliminates the movement of the circuit board relative to the base. Release agent may be coated on the edge of the circuit board and the recessed channel walls of the support base so that when required, the printed circuit board can be readily and non-destructively removed from the base.

REFERENCES:
patent: 3238281 (1966-03-01), Kato
patent: 3408436 (1968-10-01), Cubitt
patent: 3642560 (1972-02-01), Marsh

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