Method of identifying and analyzing semiconductor chip defects

Details Method of identifying and analyzing semiconductor chip defects Method of identifying and analyzing semiconductor chip defects

2006-07-25

2006-07-25

Hollington, Jermele M. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090

Reexamination Certificate

active

07081769

ABSTRACT:
According to a preferred aspect of this invention, locations of defects on a semiconductor wafer are found using semiconductor defect inspection instrumentation. Defect composition can also be determined using inspection instrumentation. Wafer defects are represented on a wafer defect map using markings wherein locations of the markings on the map correspond to the locations of the defects on the wafer. The markings also preferably represent a defect type and/or composition. Color-coded dots, for instance, can be used to represent like defect causes or types with like colors. Graphs can be prepared to display defect characteristics using distributions and skews to facilitate quick statistical analysis of the defects. In this manner, wafer defects can be analyzed quickly and efficiently based on characteristics thereof, including, for example, defect type, composition, and cause. This information can be used to help prevent future defects during mass production, thereby improving yield.

REFERENCES:
patent: 5256578 (1993-10-01), Corley et al.
patent: 5659172 (1997-08-01), Wagner et al.
patent: 5761064 (1998-06-01), La et al.
patent: 5838951 (1998-11-01), Song
patent: 5985497 (1999-11-01), Phan et al.
patent: 6016562 (2000-01-01), Miyazaki et al.
patent: 6051845 (2000-04-01), Uritsky
patent: 6122562 (2000-09-01), Kinney et al.
patent: 6246787 (2001-06-01), Hennessey et al.
patent: 6252412 (2001-06-01), Talbot et al.
patent: 6265232 (2001-07-01), Simmons
patent: 6407373 (2002-06-01), Dotan
patent: 6441897 (2002-08-01), Zeimantz
patent: 6477685 (2002-11-01), Lovelace
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6559457 (2003-05-01), Phan et al.
patent: 6559662 (2003-05-01), Yamada et al.
patent: 6567168 (2003-05-01), Nara et al.
patent: 2003/0003688 (2003-01-01), Tandy et al.

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