Method of identifying a weakest interface where delamination is

Details Method of identifying a weakest interface where delamination is Method of identifying a weakest interface where delamination is

1995-03-21

1996-02-27

Raevis, Robert

Measuring and testing

Testing of apparatus

73150R, G01N 1700

Patent

active

054939267

ABSTRACT:
A method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack formed on a semiconductor wafer includes scribing processed layers including the multi-layer dielectric film stack with an applied force of a selected and constant magnitude, measuring the depth of a cavity formed in the processed layers by such scribing, and identifying the weakest interface by comparing the measured depth against the known depths of the interfaces between adjacent layers of the multi-layer dielectric film stack.

REFERENCES:
patent: 4510798 (1985-04-01), Prussin et al.
patent: 5344236 (1994-09-01), Fishman

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