Method of holding substrate and substrate holding system

Details Method of holding substrate and substrate holding system Method of holding substrate and substrate holding system

1994-09-16

1998-08-11

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118724, 118728, 279128, 361234, H05H 100

Patent

active

057923043

ABSTRACT:
In a method of a holding substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.

REFERENCES:
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 5213349 (1993-05-01), Elliot
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5320982 (1994-06-01), Tsubone et al.
patent: 5443689 (1995-08-01), Kimura et al.
IBM Technical Disclosure Bulletin, "Electrostatic wafer holder for wafer cooling during reactive ion etching", vol. 31, No. 1, Jun. 1988.

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