Method of holding articles

Details Method of holding articles Method of holding articles

1972-11-20

1976-11-02

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156230, 156236, B32B 3114, C23F 100

Patent

active

039895661

ABSTRACT:
An array of discrete semiconductor devices is formed by photoresist and etching techniques in a semiconductor wafer waxed to a support. The photoresist material is then removed and the devices are tested. Next, a substrate is coated with silicone resin to which the devices will adhere. The devices found from the test to have a first characteristic are transferred to the resin-coated substrate to form a new array of first characteristic semiconductor devices with the original orientation. The devices are pressed against the resin by means of a polytetrafluoroethylene screen overlaid with a stainless steel screen and trichlorethylene is flowed through the screens to the devices to remove any remanent wax. When the screens are removed the devices do not stick to the polytetrafluorethylene screen, which had been against them, but remain held on the resin coated substrate in their originally oriented array.

REFERENCES:
patent: 3448510 (1969-06-01), Bippus et al.
patent: 3454457 (1969-07-01), Hale et al.
patent: 3632074 (1972-01-01), Wanesky
patent: 3663326 (1972-05-01), Wanesky
patent: 3690984 (1972-09-01), Wanesky
patent: 3755048 (1973-08-01), Schubert

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