Method of high speed plating

Details Method of high speed plating Method of high speed plating

1987-02-24

1988-02-23

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 500

Patent

active

047268840

ABSTRACT:
Disclosed is a method of high-speed plating which comprises carrying out plating of a substrate, for example, a through-hole wiring substrate, which is under being parallelly rotated in a plane including the surface of the substrate simultaneously with being vibrated in up-and-down direction and/or in right and left direction at predetermined angle with the rotating direction.

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