Method of high pressure treatment

Cleaning and liquid contact with solids – Apparatus – Sequential work treating receptacles or stations with means...

Reexamination Certificate

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Details

C134S002000, C134S026000, C134S030000, C134S035000, C134S036000, C134S042000, C134S902000

Reexamination Certificate

active

06962161

ABSTRACT:
In a high pressure processing method for removing an unnecessary substrate on the surface of the surface of a workpiece by bringing it into contact with supercritical carbon dioxide and additives in a high-pressure chamber, removing the unnecessary substance on the workpiece, first rinsing and second rinsing are performed under a substantially same pressure with continuous flowing of supercritical carbon dioxide.

REFERENCES:
patent: 6277753 (2001-08-01), Mullee et al.
patent: 2002/0014257 (2002-02-01), Chandra et al.
patent: 2002/0088477 (2002-07-01), Cotte et al.
patent: 2003/0125225 (2003-07-01), Xu et al.
patent: 2003/0217764 (2003-11-01), Masuda et al.
patent: 2004/0011386 (2004-01-01), Seghal
patent: 2004/0087456 (2004-05-01), Korzenski et al.
patent: 2004/0198627 (2004-10-01), Masuda et al.
patent: 11-087306 (1999-03-01), None
patent: 2002-336675 (2002-11-01), None
patent: 2002-353185 (2002-12-01), None
patent: 2002-367943 (2002-12-01), None
patent: 2003-031547 (2003-01-01), None

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