Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2005-05-04
2009-12-15
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Having organic semiconductive component
C257S040000
Reexamination Certificate
active
07632705
ABSTRACT:
A method of high precision printing for manufacturing organic thin film transistor, comprising the following steps of: forming a gate on a substrate; forming an insulator layer on the substrate; forming a conducting wire electrode film on the insulator layer; forming a organic interlayer; forming a organic semiconductor layer on the organic interlayer; forming a polymer layer for channel length on the organic semiconductor layer; forming a organic electrode film; and forming a protective layer. Moreover, a means for forming layers of above mentioned method is a high precision printing selected from the consisting of Inkject Printing, Screen Printing, Blade Coating, Roller Coating, Nanoimprinting, Micro Contact Printing, Flexographic printing, Table coating and Spin Coating, etc.
REFERENCES:
patent: 6335539 (2002-01-01), Dimitrakopoulos et al.
patent: 7211463 (2007-05-01), Hu et al.
patent: 2003/0160235 (2003-08-01), Hirai
Ho Jia-Chong
Hu Tarng-Shiang
Huang Liang-Ying
Lee Cheng-Chung
Industrial Technology Research Institute
King Justin
Lindsay, Jr. Walter L
Patel Reema
WPAT, PC
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