Method of hermetically sealing a space

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

65 43, 65157, 156 99, 156292, 156381, 156382, 228243, B32B 3124, C03C 2712

Patent

active

051677440

ABSTRACT:
The invention relates to a method of hermetically sealing a space, more particularly of manufacturing electronic components (9), such as CCD's, LCD's and sensors, mainly consisting of a support (13) and a covering plate (17) enclosing a cavity (19), in which a moisture-sensitive element (15) is arranged and which is hermetically sealed in that the covering plate (17) is secured by means of a thermo-setting glue (5) to the support (13), the operation of curing the thermo-setting glue (5) being carried out in a hermetically sealed chamber (11).

REFERENCES:
patent: 3862830 (1975-01-01), Stern
patent: 3995941 (1976-12-01), Nagahara et al.
patent: 4125390 (1978-11-01), Kawai et al.
patent: 4277275 (1981-07-01), Kawamura et al.
patent: 4676817 (1987-06-01), Tailor
patent: 4836434 (1989-06-01), Takenaka et al.
patent: 4906311 (1990-03-01), Gurol

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