Method of hermetically laser sealing electronic packages

Details Method of hermetically laser sealing electronic packages Method of hermetically laser sealing electronic packages

1983-11-08

1985-06-04

Albritton, C. L.

Electric heating

Metal heating

By arc

B23K 2700

Patent

active

045216681

ABSTRACT:
A method of hermetically sealing an r.f. electronic module by laser welding the perimeter of a thin, solid cover sheet over a conventional package cover. The cover sheet perimeter seats on the top surface of the package side walls and the laser weld is made between the perimeter of the weldable cover sheet and the top surface of the package side walls. This minimizes heating of the electronic package and components contained therein during sealing and possible subsequent delidding and resealing.

REFERENCES:
patent: 4117300 (1978-09-01), Ricards

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