Method of hermetically encapsulating a semiconductor device by l

Details Method of hermetically encapsulating a semiconductor device by l Method of hermetically encapsulating a semiconductor device by l

1980-10-06

1983-08-30

Rutledge, L. Dewayne

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 219121LD, H01L 2152

Patent

active

044008708

ABSTRACT:
A hermetic seal is formed without expensive precious metals by fusing two members of a semiconductor package together by scanning a laser beam along adjacent edges of the members. The compositions of the members which are fused together include ceramic, glass and metal. The method enables the formation of a hermetic seal at a relatively low temperature thereby greatly reducing the thermal stress on the semiconductor chip with resulting improvement in yields.

REFERENCES:
patent: 4291815 (1981-09-01), Gordon et al.

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