Method of hermetically encapsulating a crystal oscillator using

Details Method of hermetically encapsulating a crystal oscillator using Method of hermetically encapsulating a crystal oscillator using

1995-08-15

1997-06-24

Vo, Peter

Metal working

Piezoelectric device making

29827, 29841, 26427211, 174 524, H04R 1700

Patent

active

056407467

ABSTRACT:
A method of hermetically encapsulating a crystal oscillator using a thermoplastic shell. A first step (102) includes molding a thermoplastic shell defining a cavity around a periphery of oscillator locations on a lead frame. A second step (104) includes attaching oscillator components including a piezoelectric element, capacitors and an integrated circuit to the lead frame. A third step (106) includes dispensing an encapsulant within the cavity defined by the thermoplastic shell to encapsulate the oscillator components. A fourth step (108) includes curing the encapsulant. A last step (110) includes excising the oscillator from the lead frame and the leads are formed for mounting.

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patent: 5473512 (1995-12-01), Degani et al.
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