Method of heat treatment of wafers

Details Method of heat treatment of wafers Method of heat treatment of wafers

1976-03-16

1977-04-05

Rutledge, L. Dewayne

Metal treatment

Compositions

Heat treating

148175, 148189, H01L 21324

Patent

active

040160068

ABSTRACT:
In a method of heat-treating a number of wafers each of which consists of a substance of poor heat conduction and a semiconductor layer formed on one surface of the substance, a method of heat treatment of wafers characterized in that the heat treatment is carried out under the state under which an auxiliary wafer made of a substance of good heat conduction is held in proximity to the other surface of the substance of poor heat conduction, whereby the wafers for the heat treatment are prevented from being cracked and have the characteristics made uniform.

REFERENCES:
patent: 3808674 (1974-05-01), Francombe et al.
patent: 3936328 (1976-02-01), Nakata
patent: 3939017 (1976-02-01), Ryugo et al.
patent: 3972838 (1976-08-01), Yamashita et al.

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