Method of heat treating semiconductor wafers by varying the pres

Details Method of heat treating semiconductor wafers by varying the pres Method of heat treating semiconductor wafers by varying the pres

1993-06-25

1994-03-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437949, 148DIG38, H01L 21324

Patent

active

052964124

ABSTRACT:
A wafer boat on which semiconductor wafers are placed is inserted into a process tube, and a process gas is supplied into the process tube to perform heat treating. In this case, prior to the heat treating, the process tube is evacuated to have a pressure lower than a pressure in the heat treating while a temperature in the process tube is kept to be higher than a temperature in the heat treating. After the heat treating is performed, the process tube is purged with an N.sub.2 gas.

REFERENCES:
patent: 4190470 (1980-02-01), Walline
patent: 4438157 (1984-03-01), Romano-Moran
patent: 4698104 (1987-10-01), Barker et al.
patent: 5116784 (1992-05-01), Ushikawa
patent: 5137847 (1992-08-01), Shimakura et al.
Jintate et al., U.S. application Ser. No. 07/873,170, Apr. 1992.

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