Method of heat treating an ethylene containing polymer electrica

Details Method of heat treating an ethylene containing polymer electrica Method of heat treating an ethylene containing polymer electrica

1974-08-08

1976-05-18

White, Robert F.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 4229, 260 4233, 260 4245, 264140, 264174, 264345, C08K 554, C08K 501, B29F 310, B29B 300

Patent

active

039577198

ABSTRACT:
The power factor of electrical insulating materials comprising clay-filled ethylene-containing polymeric compounds is reduced by the presence therein of an organoalkoxysilane and heat treating the admixed compound thereof at a temperature of about 120.degree.F to about 200.degree.F for at least about 24 hours prior to forming or molding to shape.

REFERENCES:
patent: 2663909 (1953-12-01), Maier et al.
patent: 2930083 (1960-03-01), Vostorich et al.
patent: 3121768 (1964-02-01), Boyer
patent: 3148169 (1964-09-01), Marteno et al.
patent: 3802913 (1974-04-01), MacKenzie, Jr.

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