Method of heat treating a substrate with standby and treatment t

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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Details

392418, 118724, 414935, 414152, H01L 2168

Patent

active

054302714

ABSTRACT:
A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.

REFERENCES:
patent: 3830194 (1974-08-01), Benzing et al.
patent: 4178113 (1979-12-01), Beaver, II et al.
patent: 4388034 (1983-06-01), Takahashi
patent: 4542712 (1985-09-01), Sato
patent: 4669938 (1987-06-01), Hayward
patent: 4699554 (1987-10-01), Kawashima et al.
patent: 4770590 (1988-09-01), Hughes et al.
patent: 4778382 (1988-10-01), Sakashita
patent: 4820907 (1989-04-01), Terauchi et al.
patent: 4831909 (1985-07-01), Takeshita
patent: 4840530 (1989-06-01), Nguyen
patent: 4938691 (1990-06-01), Ohkase et al.
patent: 4955775 (1990-09-01), Ohkase et al.
patent: 4962726 (1990-10-01), Matsushita et al.
patent: 5009590 (1991-04-01), Mitarai et al.
patent: 5034199 (1991-07-01), Zavracky
patent: 5048164 (1991-09-01), Harima
patent: 5058526 (1991-10-01), Matsushita et al.
patent: 5089441 (1992-02-01), Moslehi
patent: 5177514 (1993-01-01), Ushijima et al.
patent: 5277579 (1994-01-01), Takanabe

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