Method of heat sinking and mounting a solid-state device

Details Method of heat sinking and mounting a solid-state device Method of heat sinking and mounting a solid-state device

1993-07-23

1994-11-15

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29842, 29874, 361718, 361719, 439487, H05K 330

Patent

active

053635523

ABSTRACT:
A unitary strip of thermally and electrically conductive spring material is formed with two rows of spring fingers formed at one end which have frictionally engaged therebetween the bus bar or plate of a solid-state device such as an FET having leads soldered to a printed circuit board. The opposite end of the strip is fastened mechanically to a conductive heat sink block on the circuit board. The strip provides electrical power, support for, and heat sinking of the solid-state device.

REFERENCES:
patent: 4204248 (1980-05-01), Proffit et al.
patent: 4388967 (1983-06-01), Breese
patent: 4707726 (1987-11-01), Tinder
patent: 4803545 (1989-02-01), Birkle

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