Method of heat-sealing substrates

Details Method of heat-sealing substrates Method of heat-sealing substrates

1981-03-20

1983-02-22

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156DIG64, 428429, 428447, 427387, 53287, C09J 300, B32B 900, B32B 1706

Patent

active

043746969

ABSTRACT:
A method of heat-sealing substrates, particularly glass to glass or glass to other materials, which comprises using as a heat-sealing medium a silicic acid heteropolycondensate prepared by hydrolysis and polycondensation of at least one organosilane and at least one component selected from the group consisting of silicon-functional silanes, substantially involatile oxides soluble in the reaction medium, or compounds convertible thereto, and organofunctional silanes.
The heat-sealing bonds obtained are strong, durable and moisture resistant, the excellent moisture resistance being of special benefit in the heat-sealing of glass substrates.

REFERENCES:
patent: 4188451 (1980-02-01), Humphrey, Jr.

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