Method of heat embossing materials subject to adhesion

Details Method of heat embossing materials subject to adhesion Method of heat embossing materials subject to adhesion

1993-01-19

1994-06-21

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156219, 156289, 1563082, 156323, B32B 3120

Patent

active

053225830

ABSTRACT:
A method is disclosed for heat embossing synthetic woven materials that exhibit adhesion properties when subject to heated dies to impart desired lettering or designs into the surface of the material. The method uses an isolation film to diminish excessive heat transfer resulting in excess adhesion to the die.

REFERENCES:
patent: 3599563 (1971-08-01), Schwartz
patent: 3703424 (1972-11-01), Charnock et al.
patent: 4047996 (1977-09-01), Kanzelberger
patent: 4092198 (1978-05-01), Scher et al.
patent: 4092199 (1978-05-01), Ungar et al.
patent: 4683018 (1987-07-01), Sutcliffe et al.

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