Method of head stack assembly flexible circuit assembly...

Details Method of head stack assembly flexible circuit assembly... Method of head stack assembly flexible circuit assembly...

2006-06-16

2009-10-13

Castro, Angel A. (Department: 2627)

Metal working

Method of mechanical manufacture

Electrical device making

C360S264200, C439S067000

Reexamination Certificate

active

07600310

ABSTRACT:
A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

REFERENCES:
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5644452 (1997-07-01), Cox et al.
patent: 5886858 (1999-03-01), Yanagihara
patent: 6480362 (2002-11-01), Yoshida et al.
patent: 2003/0002222 (2003-01-01), Abe

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